Patrick McCluskey, Diganta Das, Jill Jordan
CALCE Electronic Packaging Research Center
University of Maryland, College Park, MD 20742
P.O. Box 3707 Seattle, WA 98124
Thomas C. Torri
P.O. Box 9005 Kokomo, IN 46904
Honeywell Military Avionics
2600 Ridgeway Rd., Box 312 Minneapolis, MN 55440
Richard R. Grzybowski
United Technologies Research Center
411 Silver Lane East Hartford, CT 06108
Key words: High Temperature Electronics, Power Electronics, Electronic Packaging, Wirebonds, Solders, Semiconductors, and Capacitors.
Small signal commercial electronics have traditionally been designed to operate at temperatures below 125° C. This has become a severe constraint in the development of next generation smart power electronic systems, such as remote actuators, point-of-use power supplies, and distributed high power control systems. These systems dissipate considerable heat and can operate in environments where the local ambient temperatures reach 200° C. The ability to operate these systems without the need for active cooling is seen as a critical technology for the 21st century. The issues involved in designing silicon-based electronic systems for use at temperatures as high as 200°C are presented in this work. The critical limiting components and packaging materials have been identified through design analyses conducted on commercially available aeronautic and automotive control modules. It is found that most standard components and packaging elements can be used up to 200°C. However, capacitors, wirebonds, eutectic tin-lead solder joints, and FR-4 boards will seriously degrade at temperatures around 200°C. For these elements, alternative choices are recommended.
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