Abstract:

Parametric analytical studies are conducted to investigate whether the reliability of flip chip solder interconnects are affected by inhomogeneities in the underfill, such as settling of the filler particles. The property gradation caused by filler settling is modeled with a micromechanics formulation. The predicted property gradients are then utilized in a finite element simulation of the flip chip assembly, to assess the impact on solder interconnect reliability.

Complete article (or pdf format) is available to CALCE Consortium Members.

© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.