IEEE Transactions on Components, Packaging and Manufacturing Technology- Part A , Vol. 21, No. 2, June 1998.

Impact of Underfill Filler Particles on Reliability of Flip Chip Interconnects

K.Darbha, J.H.Okura and A.Dasgupta
CALCE Electronic Packaging Research Center
University of Maryland, College Park, MD 20742, U.S.A


Parametric analytical studies are conducted to investigate whether the reliability of flip chip solder interconnects are affected by inhomogeneities in the underfill, such as settling of the filler particles. The property gradation caused by filler settling is modeled with a micromechanics formulation. The predicted property gradients are then utilized in a finite element simulation of the flip chip assembly, to assess the impact on solder interconnect reliability.

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