Abstract:

Small signal commercial electronics have traditionally been designed to operate at temperatures below 125 °C. This has become a severe constraint in the development of next generation smart power electronic systems, such as remote actuators, point-of-use power supplies, and distributed high power control systems. These systems dissipate considerable heat and can operate in environments where the local ambient temperatures reach 200°C. The ability to operate these systems without the need for active cooling is seen as a critical technology for the 21^st century. The issues involved in designing silicon-based electronic systems for use at temperatures as high as 200°C are presented in this work. The critical limiting components and packaging materials have been identified through design analyses conducted on commercially available aeronautic and automotive control modules. It is found that most standard components and packaging elements can be used up to 200°C. However, capacitors, wirebonds, eutectic tin-lead solder joints, and FR-4 boards will seriously degrade at temperatures around 200°C. For these elements, alternative choices are recommended.

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