CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD 20742
As MCM-C's become more widely used in applications, the stresses that are placed upon them and their ability to withstand stress, become critical issues. To evaluate a system using a physics of failure approach it is important to understand the primary modes of failure. For a ceramic device, brittle failure and fracture are primary areas of concern. Typically, stress analyses done to evaluate these modes of failure in MCM-C's do not account for the effect of the vias on the strength of the package.
This is a continuation of work previously presented at ISHM '95 in Los Angeles. It takes the two dimensional results and assumptions used in the previous study and evaluates their validity. Extensive 3D and non-linear finite element analyses were done. The three-dimensional stress fields associated with blind, buried and through vias will be presented. Other loading conditions beyond uniaxial tension were investigated.
Key words: co-fired ceramics, plasticity, blind and buried vias, vias, three-dimensional stress analysis
article is available to CALCE Consortium Members.