Michael Pecht and Keith Rogers
CALCE Electronic Packaging Research Center
University of Maryland
College Park, Maryland, 20742
5000 W. Chandler Blvd.
Chandler, AZ 85226-3699
Mail Stop: CH3-84
Non-woven laminates have begun to gain recognition in the electronics industry because they are generally thinner and flatter than woven laminates. This study characterizes the mechanical and thermo-mechanical properties of non-woven, randomly dispersed, short fiber laminates, and identifies potential failure mechanisms which must be addressed in the design and utilization of printed circuit boards using non-woven technology.
Complete article is available for CALCE members only.