Circuit World , 24/3, pp. 34-37, 1998.

Characterization of a Non-Woven Randomly Dispersed Short Fiber Laminate

Michael Pecht and Keith Rogers
CALCE Electronic Packaging Research Center
University of Maryland
College Park, Maryland, 20742

Andre Fowler
Intel Corporation
5000 W. Chandler Blvd.
Chandler, AZ 85226-3699
Mail Stop: CH3-84


Non-woven laminates have begun to gain recognition in the electronics industry because they are generally thinner and flatter than woven laminates. This study characterizes the mechanical and thermo-mechanical properties of non-woven, randomly dispersed, short fiber laminates, and identifies potential failure mechanisms which must be addressed in the design and utilization of printed circuit boards using non-woven technology.

Complete article is available for CALCE members only.

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