International Journal of Microcircuits and Electronics Packaging, Vol. 20, No. 3,1998.

Packaging of Electronics for High Temperature Environments

Patrick McCluskey, Diganta Das, Jill Jordan
CALCE Electronic Packaging Research Center
University of Maryland, College Park, MD 20742

Lloyd Condra
Boeing BCAG
P.O. Box 3707 Seattle, WA 98124

Thomas C. Torri
Delco Electronics
P.O. Box 9005 Kokomo, IN 46904

John Fink
Honeywell Military Avionics
2600 Ridgeway Rd., Box 312 Minneapolis, MN 55440

United Technologies Research Center
411 Silver Lane East Hartford, CT 06108

Key Words: High temperature electronics, electronic packaging, wirebonds, solders, semiconductors, control systems, capacitors


Commercial electronics have traditionally been designed to operate at temperatures below 125° C. This has become a severe constraint in the development of next generation electronic products, such as the remote actuators, smart sensors, and distributed control systems needed for the more electric aircraft, the all electric tank, the high speed commercial airplane, and the hybrid electric vehicle. Development of electronic systems which can operate at local ambient temperatures up to 200° C without cooling is seen as a critical technology for the 21st century. The issues involved in designing silicon-based electronic systems for use at temperatures as high as 200°C are presented here. The critical limiting components and packaging materials have been identified through design analyses conducted on commercially available aeronautic and automotive control modules. Most standard components and packaging elements can be used up to 200°C. However, capacitors, gold-aluminum wirebonds, eutectic tin-lead solder joints, and FR-4 boards will seriously degrade at temperatures below 200°C. For these elements, alternative choices are recommended.

The complete article is available for CALCE members only.

[Home Page][Articles Page]