Microelectronics and Reliability ,
Vol. 38, No. 4, pp. 581-584, 1998
Impact of Pre-Conditioning, Voltage Bias and Temperature on
Reliability of Plastic Encapsulated Microcircuits
P. Sharma, K. Upadhyayula, L. Lantz and M. Pecht
CALCE Electronic Packaging Research Center
University of Maryland, College Park, MD 20742
http://www.calce.umd.edu
Abstract
This paper investigates the effect of pre-conditioning,
voltage bias and test temperature on the reliability of DIP and SOIC packages,
molded with four different epoxy compounds, which were subjected to accelerated
test conditions.
Complete article is available for CALCE members only.
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