CircuiTree , Spring 1998.

Performing Design Tradeoffs for Advanced Printed Wiring Boards

P. Sandborn
CALCE Electronic Packaging Research Center
University of Maryland, College Park, MD 20742


Electronic systems are composed of a hierarchy of chip and packaging technologies including bare die, die bonding, single chip packages, modules/boards, connectors, backplanes, and cooling structures. A key to successful electronic system design is to find the optimum combination of components, materials, and technologies in this hierarchy to meet the cost and performance goals set for the system.

The complete article is available for CALCE members only.

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