Advances in Electronic Packaging , ASME, Vol. 2, pp. 2045-2052, 1997.

Liquid-Cooling of Electronic Equipment: Where Does it Offer Viable Solutions?

W. Nakayama


In the next five years the heat flux on the microprocessor chip will rise only modestly owing to the industry-wide effort to decrease the power-bus voltage. Instead, the demands for ever more compact systems will reduce the physical space available for coolant. Accordingly, the motivation for liquid-cooling comes from the need to remove heat from constrained space. In the light of this perspective various aspects of liquid-cooling are discussed.

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