As system designers drive systems to be cheaper, better, faster, and
smaller, the impact of packaging decisions on the physical characteristics
of the system is growing. A methodology called System Virtual Prototyping
is outlined that brings analysis and optimization of these tradeoffs to
the front of the system design process. The key to this methodology
is combining accurate manufacturing information with design information
to optimize the system characteristics. An example, which was analyzed
with the SavanSys system virtual prototyping software, is presented.
The example shows how the use of a more expensive micro-via laminate substrate
technology can result in a less expensive system than conventional printed
wiring board substrate technologies under application specific design conditions.
article is available to CALCE Consortium members.