N. Kelkar, A. Dasgupta, M. Pecht, I. Knowles, M. Hawley, and D. Jennings
Condition-based health management of electronic systems involves monitoring the system condition using real-time, in-situ sensing techniques and taking appropriate maintenance actions based on the physics-of-failure (FoP) interpretation of the collected data. This paper discusses the applicability of monitoring condition degradation in printed wiring assemblies (PWA) due to potential wear-out failure mechanisms. Techniques are provided to assess the remaining life.
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