Abstract:

Condition-based health management of electronic systems involves monitoring the system condition using real-time, in-situ sensing techniques and taking appropriate maintenance actions based on the physics-of-failure (FoP) interpretation of the collected data.  This paper discusses the applicability of monitoring condition degradation in printed wiring assemblies (PWA) due to potential wear-out failure mechanisms.  Techniques are provided to assess the remaining life.

 
Complete article is available to CALCE Consortium members.