Abstract:

Commercial electronics have traditionally been designed to operate at temperature below 125°C. This task has become a severe constrain in the development of next generation electronic products, such as the remote actuators, smart sensors, and distributed control systems needed for the more electric aircraft, the all electric tank, the high speed commercial airplane, and the hybrid electric vehicle.  Development of electronic systems which can operate at local ambient temperatures up to 200°C without cooling is seen as a critical technology for the twenty first century. The issues involved in designing silicon-based electronic systems for use at temperatures as high as 200°C are presented in this work.  The critical limiting components and packaging materials have been identified through design analyses conducted on commercially available aeronautic and automotive control modules.  It is found that most standard components and packaging elements can be used up to 200°C.  However, capacitors, gold-aluminum wire bonds, eutectic tin-lead solder joints, and FR-4 boards will seriously degrade in their performance at temperature around 200°C.  For these specific elements, alternative choices are recommended in this paper.

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