Journal of Electronics Manufacturing, Vol. 7, No. 1, pp. 29-40, March 1997

In Situ Study of Solder Paste Behavior during Reflow Using the Hot-Stage Environmental Scanning Electron Microscope

M. Natishan
CALCE-Electronic Products & Systems Center

J. Powell and K. Beatty
University of Maryland,
College Park, MD 20742

Abstract:

The extensive use of surface mount applications in the microelectronics industry has increased the importance of solder from providing reliable electrical contact, must also provide sound structural support between the component and substrate, the mechanical properties of the solder interconnections are of great importance. Mechanical characteristics such as strength, ductility, and fatigue resistance are determined by the solder reflow process. Commercially, the solder reflow process consists of several steps with many interacting parameters. Thus, understanding the various aspects of the reflow procedure is crucial in producing reliable interconnections. An overview of solder processes and equipment can be found in the book by Pecht.

Complete article is available to CALCE Consortium members.



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