Circuit World, Vol. 23, No. 4, pp. 11-15, 1997.

Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuits

M. Pecht, Y. Ranade, and J. Pecht


This paper presents a study to determine the extent to which delamination at the die to encapsulant interface affects the package moisture content, and electrical failures when subjected to unbiased temperature-humidity testing. Moisture absorption experiments showed that the presence of delamination did not significantly alter the measurable moisture absorption characteristics of packages. Reliability testing indicated that although delamination is generally thought of as a reliability risk, it may not be a sufficient condition to promote damage in packages under dormant storage conditions. Experimental results showed no parametric or functional failures (or visible degradation) in packages with 100% die surface delamination after 1000 hours of unbiased testing at 140 °C/85%RH.

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