In finite element modeling, there is a desire to minimize both model
size and the total number of loading steps in a model, since this will
decrease the required analysis time and memory/storage requirements for
any given model. Several important issues faced by analysts in finite
element modeling of surface-mount interconnects are addressed. Each
of these issues represents a significant opportunity for decreasing analysis
time, yet the effects of these techniques on predictions of interconnect
durability need to be studied and quantified. Four different issues
are discussed in this paper:
1) the use of a reduced "sector" model instead of traditional models following strict geometric symmetry;
2) effect of substrate size on warpage prediction;
3) comparison of two-dimensional and three-dimensional models;
4) effect of different ramping rates in cyclic thermal loading simulations.
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