IEEE Transactions on Components, Packaging, and Manufacturing
Part A, Vol. 20, No. 2, pp. 252-256, June 1997
Uprating Electronic Components for Use Outside Teir
Temperature Specification Limits
M. Wright, D. Humphrey, and P. McCluskey
Uprating is the process to reduce the risk involved in using components
and/or systems outside the manufacturer's environmental specifications.
These risks can be segregated into three categories:
die reliability: the capability of the die to operate in the desired environment
without physical degradation by mechanisms such as electromigration or
package reliability: the capability of the packaged component to withstand
exposure to the desired environment without failing.
electrical performance: the capability of the component to perform
its electronic function in the desired environment...
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