IEEE Transactions on Components, Packaging, and Manufacturing Technology,
Part A, Vol. 20, No. 2, pp. 252-256, June 1997

Uprating Electronic Components for Use Outside Teir Temperature Specification Limits

M. Wright, D. Humphrey, and P. McCluskey


Uprating is the process to reduce the risk involved in using components and/or systems outside the manufacturer's environmental specifications. These risks can be segregated into three categories:

  1. die reliability: the capability of the die to operate in the desired environment without physical degradation by mechanisms such as electromigration or oxide breakdown.
  2. package reliability: the capability of the packaged component to withstand exposure to the desired environment without failing.

  3. electrical performance: the capability of the component to perform its electronic function in the desired environment...

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