Thermal Management of Electronic System II, Kluwer Academic Publishers, Belgium, pp. 27-41, 1997

Temperature as a Reliability Factor

M. Pecht
University of Maryland
College Park, MD 20740

Pradeep Lall
Motorola Inc.
Radio Products Group
Plantation, FL 33322

Edward Hakim
U.S. Army Research Laboratory Component Reliability Branch
Fort Monmouth, NJ 07703


Many reliability engineers and system designers consider temperature to be major factor affecting reliability of electronic equipment. Unfortunately, in an effort to improve reliability, design teams have often lowered temperature without fully understanding the impact on cooling system reliability, in dollars weight and size, and the extent on actual reliability improvement.

In this paper, various modeling methodologies for temperature acceleration of device failures are discussed, as are situations in which some current The aim is to raise the level of understanding of temperature on reliability and to define the objectives of a new temperature modeling and technology

Full article in .pdf format (Adobe Acrobat required) is available to CALCE Consortium members.

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