Abstract:

Many reliability engineers and system designers consider temperature to be major factor affecting reliability of electronic equipment. Unfortunately, in an effort to improve reliability, design teams have often lowered temperature without fully understanding the impact on cooling system reliability, in dollars weight and size, and the extent on actual reliability improvement.

In this paper, various modeling methodologies for temperature acceleration of device failures are discussed, as are situations in which some current The aim is to raise the level of understanding of temperature on reliability and to define the objectives of a new temperature modeling and technology

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