J. Powell, E. Beatty, A. Dasgupta and M. Natishan
This paper addresses the challenge of optimizing process parameters
when assembling surface mount components that have thermal adhesive under
them. The goal is to consistently produce reliable solder joints The influence
of key parameters such as adhesive volume, component alignment, and solder
paste volume and location, are explored through design of experiments.
Experimental data shows the importance of tighter process controls in stencil
design, solder paste printing, adhesive dispensing, parts placement, and
at reflow. Each step of the classic surface mount process becomes more
demanding in the presence of cured thermal adhesives because of the inability
of the component to self align or settle vertically during the solder reflow.
This can result in starved solder joints leading to costly rework and reduced