Microelectronics Reliability , Vol. 38, pp. 1607-1610, December 1997.

Reliability Assessment of a Plastic Encapsulated RF Switching Device

Rahul Mahajan and M. Pecht
CALCE Electronic Packaging Research Center
University of Maryland
College Park, MD - 20742


In this study the degradation and reliability of a plastic encapsulated RF switching device were assessed by comparing several lots of a device that came directly off the assembly line to several other lots which had been subjected to accelerated stress testing. Comparisons of the structure, die and wirebonds were based on the results of examinations using optical microscopy, X-ray analysis, scanning acoustic microscopy, environmental scanning electron microscopy and wire bond pull tests.

Complete article is available to CALCE Consortium members.

[Home Page][Articles Page]