Intentional Journal of Microelectronics Packaging, Vol. 2 (1),
Reliability of Surface Mount Capacitor Subjected to Wave Soldering
T. Panchwagh, and P. McCluskey
Many electronic circuits use capacitors for charge buffering and timing
applications. The Multi-layer Ceramic Capacitor (MLCC) is the most
commonly used capacitor for surface mount circuits. Thermal shock
encountered by MLCCs during the wave soldering operation is responsible
for yield losses greater than 0.1% industry wide [Danford, A., 1988].
The sudden exposure of the capacitor to high temperature produces large
temperature gradients in the capacitor, resulting in high stresses.
These stresses are induced by the mismatch of mechanical and thermal properties
of the constituent materials of the MLCC. Stress cracking results
from the inability of the MLCC to absorb these stresses and is aided by
manufacturing defects like delaminations, voids and inclusions that provide
ready paths for crack initiation and propagation. Various efforts
have been made to study the factors driving the generation of stresses
in the MLCC during the wave soldering process.
article is available to CALCE Consortium Members.