Microelectronics International, No. 41, pp. 23-26, September 1996.
Packaging Reliability for High Temperature Electronics: A Materials Focus
F.P. McCluskey, L. Condra, T. Torri, and J. Fink
An overview of the concerns involved in the operation of electronic
hardware at elevated temperatures is presented. Materials selection and
package design issues are addressed for a wide range of packaging elements
from the semiconductor chip to the box. It is found that most elements
of common high density device and packaging architecture can be used up
to 200C. However, gold-aluminum wirebonds, eutectic tin-lead solder joints
and die attaches, and FR-4 boards will seriously degrade at temperatures
below 200C. For these elements, alternative materials of construction are
recommended. Comparisons are made between package design for high power
dissipation and that for high temperature operation.
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