Reliability Assessments of Fielded Plastic and Hermetically Packaged Microelectronics

IEEE Transactions on Reliability, Vol. 45, No. 1, March 1996.

Reliability Assessments of Fielded Plastic and Hermetically Packaged Microelectronics

B. Johnson*, and V. Verma

ABSTRACT:

This paper presents the results from multiple studies at Honeywell, of piece part failure rates experienced in field use. These studies consider 7 line-replaceable-units (LRU), containing either hermetically sealed microcircuits (HSM) or plastic encapsulated microcircuits (PEM) or both. This paper compares the resulting field failure rates (lambda) of HSM and PEM:

digital devices: lambda_PEM approximately equal to .5 * lambda_HSM
linear devices: lambda_PEM approximately equal to 3 * lambda_HSM
only a small fraction of the linear devices degraded in performance at 125 ° C, though their performance at room temperature was within specification.

The later two points suggest that linear devices might require more attention relative to characterization over temperature and application considerations than do digital devices.

*Honeywell, Minneapolis

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