IEEE Transactions on Reliability, Vol. 45, No. 1, March 1996.

Reliability Assessments of Fielded Plastic and Hermetically Packaged Microelectronics

B. Johnson*, and V. Verma


This paper presents the results from multiple studies at Honeywell, of piece part failure rates experienced in field use. These studies consider 7 line-replaceable-units (LRU), containing either hermetically sealed microcircuits (HSM) or plastic encapsulated microcircuits (PEM) or both. This paper compares the resulting field failure rates (lambda) of HSM and PEM:

The later two points suggest that linear devices might require more attention relative to characterization over temperature and application considerations than do digital devices.

*Honeywell, Minneapolis

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