International Journal of Modeling and Simulation, Vol. 16, No. 4, 1996

A Life-Cycle Approach To Design And Manufacturing Simulation Of Multi-Chip Modules

M. Pecht and P. Lall


This paper concerns an approach developed and implement in software for assessment of multi-chip modules based on device architecture, environmental and test loads, and device mission life.  The motivation for this project, the approach taken, and the implementation impact are discussed in this paper.

Complete article is available to CALCE Consortium Members.

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