Abstract:

Defining environmental loading is usually the most uncertain part of the electronics reliability calculation. This paper demonstrates a practical methodology to measure and characterize the dynamic thermal history of the commercial airplane environment. To reduce irregular field thermal cycles, an algorithm is presented that preserves key information necessary for viscoplastic solder fatigue analysis. As an example application, the IPC solder model will be used to evaluate 20 termination leadless ceramic chip carrier on non-constrained printed wiring boards. This methodology will enable more realistic thermal fatigue reliability assessments and acceleration test specifications.
 

Complete article is available to CALCE Consortium Members.