S.Vikram and Y.Joshi
CALCE Electronic Packaging Research Center
and Department of Mechanical Engineering
University of Maryland,College Park
Abstract:
Conventional thermal analysis methods based on conduction solvers are
often not accurate enough for design purposes.Computational fluid
dynamics and conjugate heat transfer (CFD/CHT) techniques are much more
accurate,but complex and time consuming.The present study, based on
design of experiments and numerical simulations, proposes a correlation
to be used in conduction solvers to accurately represent the effect of
convection on a horizontal heated printed wiring board.