Proceedings of the 9th International Symposium on Transport Phenomena in Thermal Engineering ,
Singapore, Vol. 1, pp. 486-491, June 25-28, 1996.

Natural Convection from A Horizontal Printed Circuit Board in An Enclosure

S.Vikram and Y.Joshi
CALCE Electronic Packaging Research Center
and Department of Mechanical Engineering
University of Maryland,College Park


Conventional thermal analysis methods based on conduction solvers are often not accurate enough for design purposes.Computational fluid dynamics and conjugate heat transfer (CFD/CHT) techniques are much more accurate,but complex and time consuming.The present study, based on design of experiments and numerical simulations, proposes a correlation to be used in conduction solvers to accurately represent the effect of convection on a horizontal heated printed wiring board.

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