Abstract:

The CALCE Electronic Packaging Research Center (EPRC) located at the University of Maryland in College Park, Maryland uses software tools developed in-house to transfer technology to industry. Over the past seven years, the CALCE EPRC has developed and fielded various software tools which have aided industry in evaluating electronic packaging designs from a physics of failure standpoint. The software is used to model and assess Printed Wiring Assembly and microelectronic designs. Tools include thermal analysis, vibrational analysis, solder joint fatigue assessment and plated-through hole assessment. In the field, the CALCE software has enjoyed dual use by both government and industry consortium members.

In this paper, we will present lessons learned in the successful implementation of software as a technology transfer vehicle. To this end, several case studies of industrial usage will be presented. The following examples will be included. Honeywell has used CALCE software to perform thermal assessments of a new cooling technology which could not be performed with existing software tools. AlliedSignal has integrated CALCE software into their Integrated Product Design System. Texas Instruments has incorporated software tools developed by the CALCE EPRC into their internally used Computer Aided Reliability and Maintainability Applications (CARMA) tool suite. The U.S. Army has used the CALCE PWA software to compare commercial and ruggedized microelectronic assemblies.

Complete article is available to CALCE Consortium Members.