Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages
M. Li, and M. Pecht
Environmental Scanning Electron Microscopy (E-SEM) is a technique which
provides the capability to investigate surface morphologies over a variety
of controllable environmental conditions. This paper discusses the
principal of the E-SEM and presents three experimental investigations of
failure mechanisms in electronic packages using E-SEM techniques.
The first is a study of thermally induced failures of MMIC devices.
The second investigation concentrates on relative humidity and thermal
cycling effects on interfacial bonding characteristics of resin/fiber interfaces
in printed wiring boards, and micro-cracks surrounding plated-through-holes.
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