Many reliability engineers and system designers consider temperature to be a major factor affecting the reliability of electronic equipment. Unfortunately, in an effort to improve reliability, design teams have often lowered temperature without fully understanding the impact on cooling system reliability, in dollars, weight, and size, and the extent of any actual reliability improvement.
In this paper, various modeling methodologies for temperature acceleration of microelectronic device failures are discussed, as are situations in which some current methodologies give misleading results. The aim is to raise the level of understanding of the impact of temperature on reliability and to define the objectives of a new temperature modeling and design methodology.
article is available to CALCE Consortium Members.