A Framework For Reliability Modeling Of Electronics
E. Hakin, M. Osterman and C. Rust
The Physics-of-Failure approach (PoF) to design, reliability modeling,
testing, and screening of single chip packages and multichip modules (MCM),
has been developed. The PoF approach is implemented in the CADMP-II
Software. The PoF approach is based on the identification of potential
failure mechanisms and failure sites for the product. Failure mechanisms
are described by models which characterize the physics of degradation processes
leading to failure at each potential failure site. The loads at each
failure site are obtained as a function of environmental and operation
conditions. The approach proactively incorporates reliability in
the design process by establishing a scientific basis for evaluation of
new materials, structures, and technologies, thorough design of tests,
screens, safety factors, and acceleration transforms, based on the knowledge
of failure mechanisms and modes.
article is available to CALCE Consortium Members.