The physics-of-failure approach is not only a tool to allow better and more effective approaches for improving the entire approach to building electronic systems.  Reliability assessments based on physics-of-failure methods incorporate reliability into the design process so that no parts fail in service.  An understanding of the physics-of-failure is necessary in applications which afford little opportunity for testing, or for reliability growth.  A case study of conductive filament formation in laminated substrates consisting of dense circuitry based on statistically designed experiments using the physics-of-failure approach is discussed in this paper.

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