A. Dasgupta, and M. Pecht
Temperature has been considered by many reliability engineers and system
designers as a major contribution to the unreliability of electronic equipment.
As a result, temperature has often been lowered without fully understanding
the impact of the cooling system reliability; the cost of temperature reduction
in terms of dollars, weight and size; and any actual reliability improvement
gained by lowering temperature. In this paper, existing methodologies
for modeling the temperature-dependence of microelectronic device failures
are discussed, and the reasons why these can lead to misleading results
are explained. An alternate methodology is suggested at the end,
to define the objectives of new design models which provide more realistic
relationships between temperature and microelectronic failure mechanisms.
The new methodology is based on an increased level of understanding of
the role of temperature, and is intended to help the reliability community
break away form existing misleading paradigms.
article is available to CALCE Consortium Members.