B. Rudra, M. Li, M. Pecht, and D. Jennings
Laminated substrates are used widely in the manufacture of multichip modules (MCM-L) by the electronics packaging industry. Of late, the thrust has been towards high density circuitry to achieve improved performance and reduced size. This has led to the use of finer lines and spacing, smaller drilled holes and buried vias in organic laminates leading to reliability issues such as electrochemical migration.
One of the forms of electrochemical migration is known as conductive
filament formation. Conductive filament formation is an electrochemical
process. In accelerated environments of temperature and humidity, organic
laminates can develop a loss of insulation resistance between conductors,
eventually resulting in loss of electrical function of the circuit. The
paper aims ar discussing electrochemical migration in general, and conductive
filament formation in particular, and its impact on the reliability of
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