Modern commercial and military systems rely heavily on large quantities
of electronics with high packaging densities. System readiness is
strongly dependent upon the reliability of each electronic subsystem, its
associate circuit card assemblies and individual components. Currently
missing in electronic system reliability assessment is computer simulation
from the circuit card level upward in the electronic system. The
performance of the electronic box directly effects the reliability of the
electronics inside the box since the box filters many environmental loads
such as shock and vibration, temperature change, etc. A research
effort has been initiated by the CALCE Electronic Packaging Research Center,
sponsored by the Defense Modeling and Simulation Office (DMSO), to develop
a software program to perform electronic box-level reliability assessment.
In addition to the box level assessment, more reliable dynamic load information
will be available from the program to be transmitted downward to the PWB
and component level for further reliability assessment. A description
is presented in this paper of the software program that has been developed.
Further improvement of the software tool will continue to increase its
robustness and sophistication by incorporating user's suggestions.
Complete article is available to CALCE Consortium Members.