Advanced interconnect technology (AIT) packaging involves implementation of advanced overlay technologies, including (high-density interconnects, flip chip interconnects, and advanced silicon substrates. As part of a joint NASA-Army-Navy Air Force Reliability technology program (RELTECH), a effort was initiated with the CALCE- Electronic Packaging Research Center to develop and conduct a detailed understanding of potential reliability problems and failure mechanisms, and then develop suitable technology characterization and qualification procedures for AIT structures for space and military environments. Detailed finite element models for computation of thermal, mechanical and thermomechanical responses for AIT packages have been developed and have been incorporated into software tools. This paper discusses the approach adopted on developing the software tools and an example to illustrate the successful implementation of the approach.

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