The Effect Of Manufacturing And Design Process Variabilities On The Fatigue Life Of The High Density Interconnect Vias
A.O. Ogunjimi, S. MacGregor, M. Pecht and J. Evans
Via fatigue failure has been identified as a potential failure mechanism
in high density interconnects. This failure mechanism is directly, influenced
by the stress-strain level at the potential points of failure in the structure
and the ductility of the via material. This paper looks at the effect of
some manufacturing and design process variables on the fatigue life of
the vias. The key variables are the trace or conductor thickness (metallization
thickness), the layer or layers of the dielectric around the trace and
in the via, the via geometry, wall slope, the ductility coefficient of
the conductor material and the strain concentration factor. The metallization
thickness is found to have the most dramatic effect on the fatigue life
of the via compared to the other design variables. Good via ductility and
strain concentration factors improve the fatigue life drastically.
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