Circuit World , Vol. 21(2), pp. 12-18, 1995.

A Reliability Study of Fuzz Button Interconnects

D.B. Harris and M. Pecht


This paper presents the methods and results of load, deflection and electrical contact resistance experiments for reliable electronic module design using fuzz button technology.  Both beryllium copper (BeCu) and molybdenum (Mo) fuzz button contacts were examined, as a function of wire diameter, button diameter and button density.
  Complete article is available to CALCE Consortium Members.

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