ASME National Heat Transfer Conference , Portland, OR, August 1995.

Computations Of Solid/Liquid Phase Change In A Three-Dimensional Enclosure By A Uniformly Dissipation Heat Source

D. Pal and Y. K. Joshi


An analysis of melting of a phase change material by a uniformly dissipating flush mounted heat source in a rectangular enclosure is performed.  Phase change process is modeled by an implicit enthalpy-porosity technique (Brent et al. 1988).  Computations are performed using finite volume technique by SIMPLER algorithm (Patankar, 1980).  The effect of natural convection in the molten PCM is considered.  Computations are performed for various power dissipation levels.  Effects of enclosure aspect ratio and substrate thermal conductivity on the melting and heat transfer are studied.  Results showed that increase in enclosure aspect ratio (Ap =YL/XL) results in an increase of melting rates.  Higher substrate thermal conductivity affected the melt front morphology and the temperature distribution.  For low conductivity substrate, the melting is localized near the heat source, whereas for higher substrate conductivity, the melt shape extends throughout the length and height of the substrate.  Moderate reduction in temperature was observed for a higher thermal conductivity substrate.

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