D. Pal and Y. K. Joshi
An analysis of melting of a phase change material by a uniformly dissipating
flush mounted heat source in a rectangular enclosure is performed.
Phase change process is modeled by an implicit enthalpy-porosity technique
(Brent et al. 1988). Computations are performed using finite volume
technique by SIMPLER algorithm (Patankar, 1980). The effect of natural
convection in the molten PCM is considered. Computations are performed
for various power dissipation levels. Effects of enclosure aspect
ratio and substrate thermal conductivity on the melting and heat transfer
are studied. Results showed that increase in enclosure aspect ratio
(Ap =YL/XL) results in an increase of melting rates. Higher substrate
thermal conductivity affected the melt front morphology and the temperature
distribution. For low conductivity substrate, the melting is localized
near the heat source, whereas for higher substrate conductivity, the melt
shape extends throughout the length and height of the substrate.
Moderate reduction in temperature was observed for a higher thermal conductivity
Complete article is available to CALCE Consortium Members.