IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A,
Vol. 17, No. 4, pp. 610-614, December 1994.

Development Of An Alternative Wire Bond Test Technique

P. Lall, M. Pecht, and D. Barker


Abstract:

An alternative test technique to the wire bond interconnects.  The new test technique, based on electromagnetic resonance, has the potential for on-line use as a quality assurance and operational life evaluation method.  The new technique greatly reduces the test time in comparison with the existing MIL-STD-883 pull test and internal visual inspect ion.  This new test technique more closely simulates the operational stress than the wire bond pull test and has also shown a sensitivity to defects that would otherwise escape visual inspection.
 

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