Development Of An Alternative Wire Bond Test Technique
P. Lall, M. Pecht, and D. Barker
An alternative test technique to the wire bond interconnects.
The new test technique, based on electromagnetic resonance, has the potential
for on-line use as a quality assurance and operational life evaluation
method. The new technique greatly reduces the test time in comparison
with the existing MIL-STD-883 pull test and internal visual inspect ion.
This new test technique more closely simulates the operational stress than
the wire bond pull test and has also shown a sensitivity to defects that
would otherwise escape visual inspection.
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