Development of an Alternative Wire Bond Test
P. Lall, M. Pecht, and D. Barker
An alternative test technique to the wire bond pull test is presented
for wire bond interconnects. The new test technique based on electromagnetic
resonance, has the potential for on-line use as a quality assurance and
operational life evaluation method. The new technique greatly reduces the
test time in comparison to the existing MIL-STD-883 pull test and internal
visual inspection. This new test technique more closely simulates the operational
stress than the wire bond pull test and has also shown a sensitivity to
defects including ball off pad, shallow stamps at stitch bonds, and small
ball bonds. The sensitivity of the test technique in terms of different
failure signature for various failure modes has also been demonstrated.
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