An alternative test technique to the wire bond pull test is presented for wire bond interconnects. The new test technique based on electromagnetic resonance, has the potential for on-line use as a quality assurance and operational life evaluation method. The new technique greatly reduces the test time in comparison to the existing MIL-STD-883 pull test and internal visual inspection. This new test technique more closely simulates the operational stress than the wire bond pull test and has also shown a sensitivity to defects including ball off pad, shallow stamps at stitch bonds, and small ball bonds. The sensitivity of the test technique in terms of different failure signature for various failure modes has also been demonstrated.
 

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