Simulation of the Influence of Manufacturing Quality on Reliability of Vias
V. Ramappan and A. Dasgupta
Techniques based on physics-of-failure principles are fairly well established
for mechanical design of electronic packages. This paper provides
an example where such techniques can also be exploited to develop guidelines
for assessment of manufacturing quality and its impact on reliability.
As a case study, plating waviness in Plated Through Holes (PTH) is modeled
to investigate their performance during solder re-flow cycles and during
subsequent operational thermal cycling. The stress analysis is performed
with elastic-plastic finite element models which are seeded with various
levels of plating waviness defects. Sensitivity analysis is done
with factorial parametric simulation studies based on Design of Experiment
(DoE) methods. Buckling and fatigue failure models are used to establish
inspection criteria for acceptable thresholds of plating waviness.
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