Tutorial - Failure-Mechanism Models for Conductive-Filament Formation
B. Rudra and D. Jennings
This tutorial illustrates design & qualification situations where
conductive filament formation, a failure mechanism that occur in laminates,
con affect product performance. Empirical models (developed over
the years) to design against this failure mechanism are presented in this
paper. Examples illustrate the use for these models for design &
qualification tests in electronic packaging.
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