IEEE Transactions on Reliability , Vol. 43, No. 3, September 1994

Tutorial - Failure-Mechanism Models for Conductive-Filament Formation

B. Rudra and D. Jennings


This tutorial illustrates design & qualification situations where conductive filament formation, a failure mechanism that occur in laminates, con affect product performance.  Empirical models (developed over the years) to design against this failure mechanism are presented in this paper.  Examples illustrate the use for these models for design & qualification tests in electronic packaging.

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