Each of the three different polyamide films used in General Electric and Texas Instrument high-density interconnects has been characterized in terms of its out-of-plane and in-plane coefficient of thermal expansion, glass transition temperature, storage modulus, loss factor, and stress-strain and creep behavior, as a function of temperature and, as appropriate, deformation rate.  This paper discusses these factors and the failure mechanisms of Kapton® and ULTEM® films in tensile tests.
 

Full article in .pdf format (Adobe Acrobat required) is available to CALCE Consortium members.

© IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

[Home Page] [Articles Page]