IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B,
Vol. 17 (4), pp. 632-639, November 1994.

Characterization of Polymides Used in High Density Interconnects

M. Pecht and X. Wu


Each of the three different polyamide films used in General Electric and Texas Instrument high-density interconnects has been characterized in terms of its out-of-plane and in-plane coefficient of thermal expansion, glass transition temperature, storage modulus, loss factor, and stress-strain and creep behavior, as a function of temperature and, as appropriate, deformation rate.  This paper discusses these factors and the failure mechanisms of Kapton® and ULTEM® films in tensile tests.

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