B. Rudra, M. Pecht and D. Jennings
Multi-layer organic laminates used in printed wiring boards and laminated
multichip modules (MCM-L), can develop a loss of insulation resistance
between two traces, between a trace and a via, and between two vias, due
to the growth of conductive along the epoxy resin/glass interface.
The growth of the filaments is a function of temperature, humidity, voltage,
laminate material, manufacturing processes and the geometry and spacing
of the conductors. In order to develop a model which can be used
to establish both design guidelines for the prevention of conductive filament
formation, and tests for product qualification, a design of experiments
study was conducted. Temperature, humidity, and a voltage were the
stress parameters, and conductor spacing, conductor geometry, laminate
material (FR-4, BT and CE) and surface coating (presence and absence of
solder mask, solder plate, and post coat) were the laminate parameters.
The experimental approach, the analyses of results, and a model from time-to-failure
due to conductive filament formation which unifies this study with previous
studies, are presented in this paper.
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