A Physics-Of-Failure (PoF) Approach To Addressing Device Reliability In Accelerated Testing of MCMs
J. Evans, M. Cushing, P. Lall, and R. Bauernschub
The physics-of-failure testing approach for multi-chip modules presented
in this paper determines test levels based on failure mechanisms, failure
modes, and stresses for the application. It uses quantitative failure
models and acceleration transforms, and adapts the knowledge of dominant
failure mechanisms to the selection of accelerating stress parameters.
The stress levels, designed specifically for each test article, are based
on manufacturing processes, geometry, and materials.
article is available to CALCE Consortium Members.