Modeling PTH Damage Caused by Insertion Mount Connectors
G. Ganguly and A. Dasgupta
Stresses arising in plated through holes (PTH), vias and surrounding
printed wiring board (PWB) substrates due to lead insertion forces of insertion-mount
connectors are modeled analytically. The analytical modes is based
on separation of variable techniques using Fourier series, and will be
calibrated in future using both experimental measurements as well as numerical
finite element results. Only linear elastic results are presented
in this paper, to predict deformation and stresses in the assembly.
Incremental load-stepping methods will be used in future, to handle nonlinear
material properties such as copper plastic properties and PWB substrate
post-damage properties. The goal is to develop mechanistic predictive
models to reduce the need for highly repetitive and costly failure analysis
for damage evaluation, resulting in significant cost savings to the industry
as a whole.
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