Modeling Solder Joint Fatigue Life for Gullwing Leaded
Part 1 Elastic Plastic Stress Model
V. Gupta and D. Barker
It is a challenge to assess solder joint fatigue life in the modern
electronics industry because of complex geometries, complex non-linear
visco-plastic material properties, and the frequently changing environmental
conditions. The first step in the fatigue life assessment process
is to find the stress distribution in the solder. Traditionally,
this has been done using numerical tools like finite element methods.
The finite element approach is very expensive since it requires a highly
trained and experienced analyst and huge computing resources, while the
accuracy is always questioned. This study aims to develop a more
accurate analytical-cum-empirical model to predict critical stresses in
the solder joint so as to avoid the necessity of finite element simulation.
This paper presents a generic elastic-plastic stress model that is obtained
based on theoretical stress analysis solutions that is tweaked by using
a design of experiments technique with FEA simulations.
article is available to CALCE Consortium Members.