7th International SAMPE Electronics Conference, pp. 432-445, June 20-23, 1994

Characterization of Polyimides Used in GE-High Density Interconnects

M. Pecht and X. Wu


The three different polyimide films use in General Electrical high density interconnects have been characterized in terms of their out-of-plane and in-plane coefficient of thermal expansion. Glass transition temperature, storage modulus loss factor, and stress-strain and creep behavior, as a function of temperature and as appropriate, deformation rate. In addition, this paper discusses failure mechanisms of Kapton and ULTEM films in tensile tests.

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