Proceedings of the First International Symposium on Microelectronic Package and PCB Technology,
Beijing, China, pp. 175-180, September 19-23, 1994.

Physics-of-Failure Approach to Design and Reliability Assessment of Microelectronic Packages

M. Pecht


A physics-of-failure approach has been developed for the design and reliability assessment of Microelectronic Packages based on device architecture, environment and test loads, and device mission life.  Some of the features of these software tools are discussed.

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