Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid
Y. Joshi, M. Kelleger, M. Powell and E. Torres
An experimental investigation of natural convection liquid immersion
cooling of a three by three array of rectangular protrusions in an enclosure
is presented. The heated elements geometrically simulated 20 pin
dual-inline electronic packages and were mounted on a plexiglass substrate,
which formed one vertical wall of a dielectric liquid filled rectangular
enclosure. The remaining vertical boundaries of the enclosure were
insulated, while the top and bottom were maintained at prescribed temperature
using individual heat exchanger plates. Protrusion surface temperatures
in steady state are reported for a range of power dissipation levels for
three flourinert liquids spanning a Prandtl number range from about 20
to 1400. The influence of enclosure top and bottom surface boundary
conditions and its width on element temperatures is investigated.
Non-dimensional heat transfer results are empirically correlated.
Changes in component temperatures due to partial powering of the array
are also measured.
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