Liquid Flow-Through Cooling of Electronic Modules
S. Sridhar, M. Osterman, J. Carbonell, and K. Herold
Thermal management of future avionics modules will be a critical design
issue. New advanced in integrated circuit technology and electronic packaging
will allow the design of densely populated electronics modules with potential
power dissipation levels in excess of 1.0 W/cm2
While the module power level trend will be to increase, the maximum
allowable junction temperature for integrated circuits may be lowered to
provide more benign thermal environment for electronics. This negates the
use of conventional thermal management techniques in new avionics application.
A number of trade studies were performed to determine which cooling technique
would be best suited to meet the anticipated reliability and performance
requirements for the year 2005 and beyond. The approaches to module cooling
technologies considered were: edge cooled conduction, immersion and hollow
core flow-through. The technology selected was the hollow core flow-through.
This paper discusses the results of flow through cooling investigations
on both single-pass cold plates and SEM-E modules.
article is available to CALCE Consortium Members.